The third dimension: The logical step for III-Vs

Authors
김상현김성광김형준
Issue Date
2017-06
Citation
CS Magazine, v.23, no.4, pp.42 - 46
Keywords
III-V compound semiconductor; wafer bonding; epitaxial lift-off; field effect transistor; monolithic 3D integration
ISSN
2042-7328
URI
https://pubs.kist.re.kr/handle/201004/122666
Appears in Collections:
KIST Article > 2017
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