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Silica aerogel/polyimide composites with preserved aerogel pores using multi-step curing

Authors

Kim, Seong Yun; Noh, Ye Ji; Lim, Jun; You, Nam-Ho

Issue Date

2014-01

Publisher

POLYMER SOC KOREA

Citation

MACROMOLECULAR RESEARCH, v.22, no.1, pp.108 - 111

Keywords

Composites; Aerogel; Thermal Conductivity; Insulation; Polyimide; Curing; Silica Aerogel

ISSN

1598-5032

URI

https://pubs.kist.re.kr/handle/201004/127291

DOI

10.1007/s13233-014-2006-0

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KIST Article > 2014

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