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Vacuum packaging using anodic bonding and emission characteristics of FED

Title
Vacuum packaging using anodic bonding and emission characteristics of FED
Authors
이덕중; 주병권; 정지원; 김훈; Sung-Jae Jung; 장진; 오명환
Keywords
FED; FEA; MEMS; Glass bonding; silicon film; leak test; packaged FED; light emission; sta
Issue Date
1999-03
Publisher
Proc. ASID '99
Citation
, 53-56
URI
https://pubs.kist.re.kr/handle/201004/13019
Appears in Collections:
KIST Publication > Conference Paper
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