Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Abstract

The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 degrees C in the supercooled liquid region. The crystallization process is a single step phase, transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate. (c) 2007 Published by Elsevier B.V.