Middle- and high-permittivity dielectric compositions for low-temperature co-fired ceramics

Abstract

Various middle- and high-permittivity dielectric material systems for LTCC were examined. By designing several borosilicate glass frit systems carefully, we tried to lower the temperature of densification to 875 degrees C in selected host dielectric materials still maintaining acceptable dielectric properties. The effects of glass addition on the densification. electrical properties. and phase changes in the host dielectric materials were examined. (c) 2006 Published by Elsevier Ltd.