A numerical model incorporating friction induced temperatures for contact recording applications

Authors
Kim, JHShin, KH
Issue Date
2000-09
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Citation
IEEE TRANSACTIONS ON MAGNETICS, v.36, no.5, pp.2692 - 2695
Abstract
The study deals with the development of a computational procedure for evaluating the temperature rise in layered concentrated contacts of head/disk interface. A transient computational model is utilized, The computational distribution of temperature is obtained with the analytical findings for various composition and contact conditions. This general class of problems can be treated provided that heat generation distribution and layer properties are known. It can also provide tribological evaluation to analyze the thermal pulse that induces thermal signals in the head.
Keywords
LAYERED CONCENTRATED CONTACTS; HEAT PARTITION; INTERFACE; LAYERED CONCENTRATED CONTACTS; HEAT PARTITION; INTERFACE; flash temperature; friction; head/disk interface; temperature rise; thermal asperity
ISSN
0018-9464
URI
https://pubs.kist.re.kr/handle/201004/141150
Appears in Collections:
KIST Article > 2000
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