A new chemical amplification resist system based on novolac and t-BOC protected phosphazene as a dissolution inhibitor

Authors
Ahn, K.-D.Kang, J.-H.Kim, S.-J.Park, B.-S.Park, C.-E.Park, C.-G.
Issue Date
1992-01
Citation
Journal of Photopolymer Science and Technology, v.5, no.1, pp.67 - 77
Abstract
t-BOC protected hexakis(4-t-BOC-phenoxy)cyclotriphosphazene, TBP, was synthesized from a semiinorganic phosphazene compound and its acid-catalyzed thermal deprotection was utilized in the design of a three-component positive resist system based on the combined principles of chemical amplification and dissolution inhibition. The new resist system, PTPNS(NR/TBP/PAG), is formulated with novolac resin (NR), TBP and a photoacid generator (PAG). The dissolution characteristics of PTPNS in alkaline development are ideally suited for application to positive type resists which are based on a dissolution inhibition mechanism. The t-BOC protected TBP of the PTPNS resist system effectively acts as an acid-labile dissolution inhibitor of novolac resin when TBP concentration is more than 10 % by weight. As a representative, PTPNS(100/15/5) (by weight parts) exhibited high sensitivity in the range of 20 to 25 mJ/cm2 with contrast of 5 after exposure at 250nm light and PEB treatment at 100 to 130°C. Appropriately formulated PTPNS resist rendered positive-tone patterns down to sub-half micron with high sensitivity when the resist was exposed to KrF excimer laser or electron beam and developed with 2.38 wt% tetramethylamonium hydroxide solution. ? 1992, The Society of Photopolymer Science and Technology(SPST). All rights reserved.
Keywords
three component positive resist materials; deep UV resists; dry etch resistance; chemical amplification resists; dissolution inhibition resist; t-BOC protected phosphazene; novolac resin; photosensitivity
ISSN
0914-9244
URI
https://pubs.kist.re.kr/handle/201004/146699
DOI
10.2494/photopolymer.5.67
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KIST Article > Others
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