A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment
- Title
- A method of improving dielectric constant and adhesion strength of methysilsesquioxyane by using a NH3 plasma treatment
- Keywords
- low-k
- Issue Date
- 2001-04
- Publisher
- Material Research Society (MRS) 2001 spring Meeting
- Citation
- , 231.-231.
- Appears in Collections:
- KIST Publication > Conference Paper
- Files in This Item:
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