Al-AlN composite manufactured by gas reaction method for high thermal conductivity and low thermal expansion

Abstract

Optimum heat-sink materials of LED devices have been expected to improve using LED’s life-time. Low thermal conductivity and high thermal expansion of the heat-sink materials cause bad efficiency and become a main reason to reduce life-time. Although Al is a good material for heat-sink applications, it has high thermal expansion coefficient. Therefore it needs complex composite with low thermal expansion such as AlN and Si3N4. In this study, we try to manufacture Al-AlN composites with high thermal conductivity and low thermal expansion coefficient. In particular, the formation mechanism of AlN was investigated with the role of Mg catalyst and the processing temperature.