Full metadata record

DC FieldValueLanguage
dc.contributor.author고문주-
dc.contributor.author김채빈-
dc.contributor.author김영수-
dc.contributor.author이승희-
dc.date.accessioned2021-06-09T04:19:19Z-
dc.date.available2021-06-09T04:19:19Z-
dc.date.issued2017-11-
dc.identifier.other50035-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/66947-
dc.publisher한국공업화학회 2017 추계 학술대회-
dc.subject액정성에폭시-
dc.subject합성-
dc.subject열전도도-
dc.subject복합재료-
dc.titleLiquid Crystalline Epoxy Resin/Alumina Composites for Highly Thermal Conducting Circuit Board-
dc.typeConference Paper-
Appears in Collections:
KIST Publication > Conference Paper
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE