Ultrathin Plasmonic Optical/Thermal Barrier: Flashlight-Sintered Copper Electrodes Compatible with Polyethylene Terephthalate Plastic Substrates
- Ultrathin Plasmonic Optical/Thermal Barrier: Flashlight-Sintered Copper Electrodes Compatible with Polyethylene Terephthalate Plastic Substrates
- 조민경; 정영우; 박혜진; 김도진; 이수연; 최영민; 정선호
- plasmonic; flash; sinter; copper; electrode; PET
- Issue Date
- ACS Applied Materials & Interfaces
- VOL 9, NO 50-43821
- In recent years, highly conductive, printable electrodes have received tremendous attention in various research fields as the most important constituent components for large-area, low-cost electronics. In terms of an indispensable sintering process for generating electrodes from printable metallic nanomaterials, a flashlight-based sintering technique has been regarded as a viable approach for continuous roll-toroll processes. In this paper, we report cost-effective, printable Cu electrodes that can be applied to vulnerable polyethylene terephthalate (PET) substrates, by incorporating a heretoforeunrecognized ultrathin plasmonic thermal/optical barrier, which is composed of a 30 nm thick Ag nanoparticle (NP) layer. The different plasmonic behaviors during a flashlight-sintering process are investigated for both Ag and Cu NPs, based on a combined interpretation of the experimental results and theoretical calculations. It is demonstrated that by a continuous printing process and a continuous flashlight-sintering process, the Cu electrodes are formed successfully on large PET substrates, with a sheet resistance of 0.24 Ω/sq and a resistivity of 22.6 μΩ·cm.
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