Growth and Interlayer Engineering of 2D Layered Semiconductors for Future Electronics
- Growth and Interlayer Engineering of 2D Layered Semiconductors for Future Electronics
- 곽준영; 노기창; 송찬우; 김태수; 강민수; 송화영; 함아영; 조민경; 조서린; 채현준; 조성래; 조기원; 박정원; 송승우; 송인택; 방성환; 강기범
- 2D layered materials; growth; target-oriented growth technique; interlayer engineering; intercalation; electronics; quantum emitter; neuromorphic device
- Issue Date
- ACS Nano
- VOL 14, NO 12-16300
- Layered materials that do not form a covalent bond in a vertical direction can be prepared in a few atoms to one atom thickness without dangling bonds. This distinctive characteristic of limiting thickness around the sub-nanometer level allowed scientists to explore various physical phenomena in the quantum realm. In addition to the contribution to fundamental science, various applications were proposed. Representatively, they were suggested as a promising material for future electronics. This is because (i) the dangling-bond-free nature inhibits surface scattering, thus carrier mobility can be maintained at sub-nanometer range; (ii) the ultrathin nature allows the short-channel effect to be overcome. In order to establish fundamental discoveries and utilize them in practical applications, appropriate preparation methods are required. On the other hand, adjusting properties to fit the desired application properly is another critical issue. Hence, in this review, we first describe the preparation method of layered materials. Proper growth techniques for target applications and the growth of emerging materials at the beginning stage will be extensively discussed. In addition, we suggest interlayer engineering via intercalation as a method for the development of artificial crystal. Since infinite combinations of the host？intercalant combination are possible, it is expected to expand the material system from the current compound system. Finally, inevitable factors that layered materials must face to be used as electronic applications will be introduced with possible solutions. Emerging electronic devices realized by layered materials are also discussed.
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