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An assembly and interconnection technology for micromechanical structure using a anisotropic conductive film

Title
An assembly and interconnection technology for micromechanical structure using a anisotropic conductive film
Authors
I. B. Kang; 주병권; M. R. Haskard
Keywords
MEMS; micromachining; wafer bonding
Issue Date
1996-10
Publisher
SPIE 1996 symp. micromachining and microfabrication, Austin, Texas.
Citation
, ?-?
URI
https://pubs.kist.re.kr/handle/201004/7643
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KIST Publication > Conference Paper
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