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Chip on Chip Bonding Technology for Fine Pitch Connection With Al-Si/TiN Bumps

Authors

Lee, Myung Jae

Issue Date

2018-09-10

Publisher

IIAE

Citation

IIAE International Conference on Intelligent Systems and Image Processing

URI

https://pubs.kist.re.kr/handle/201004/79066

Appears in Collections:

KIST Conference Paper > 2018

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