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Development of Thermal Residual Stresses and Warpage in Film insert molded Parts

Authors

Kim, Seong Yun

Issue Date

2008-02

Publisher

한국유변학회

Citation

2008 Proceedings of The 8th Annual Meeting of the Applied Rheology Center, pp.31 - 34

URI

https://pubs.kist.re.kr/handle/201004/81382

Appears in Collections:

KIST Conference Paper > 2008

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