DSpace at KISTKIST PublicationArticle

Organo-soluble, segmented rigid-rod polyimide films: 2. Properties for microelectronic applications.

Title
Organo-soluble, segmented rigid-rod polyimide films: 2. Properties for microelectronic applications.
Authors
Fred E. Arnold Jr.; Stephen Z. D. Cheng; Steven L.-C. Hsu; 이철주; Frank W. Harris; Suk-Fai Lau
Keywords
coefficient of thermal expansion; dimensional stability; glass transition temperature; microelectronic application; relative permittivity; segmented rigid-rod polyimide film; thermal and thermo-oxidative stability; thermogravimetric mass spectroscopy; thermomechanical measurement
Issue Date
1992-01
Publisher
Polymer
Citation
v. 33, no. 24, 5179-5185
URI
https://pubs.kist.re.kr/handle/201004/8407
ISSN
0032-3861
Appears in Collections:
KIST Publication > Article
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML
Show Full Item Record


qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE