Enhancement of the electrical and physical properties of Cu/W-N/HSQ interconnection scheme by NH3 plasma treatment

Authors
Kim, Yong Tae
Issue Date
2000-07-24
Citation
, pp.0
URI
https://pubs.kist.re.kr/handle/201004/84351
Appears in Collections:
KIST Conference Paper > 2000
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE