Improving adhesion of polytetrafluoroethylene to aluminum, copper, and an adhesive by Ar+ irradiation with and without oxygen environment

Abstract

Adhesion tests were conducted on 2000angstrom thick Al or Cu film which is evaporated in the irradiated and unirradiated PTFE samples with and without oxygen environment. With regard to Al film, partial detachment of the film occurs when the PTFE was irradiated without O2 environment, regardless of ion dose. No detachment of the film occurred when PTFE was irradiated with O2 environment with the ion dose exceeding 1×1016. As to the Cu film, partial detachment was observed with and without O2 environment with the ion dose was 5×1015 ions/cm2 or greater. The adhesion of an adhesive to the irradiated PTFE samples was found to increase significantly with increasing ion dose up to 1×1016 ions/cm2 in tensile tests.