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Comparization of amorphous and polycrystalline tungsten nitride diffusion barrier for MOCVD-Cu metallization

Authors

Kim, Yong Tae

Issue Date

1994-07-01

Citation

1994 Fall Meeting of MRS, pp.0

URI

https://pubs.kist.re.kr/handle/201004/86026

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KIST Conference Paper > Others

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