Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Shim Jae Phil | - |
| dc.contributor.author | Ju, Gunwu | - |
| dc.contributor.author | kim seong kwang | - |
| dc.contributor.author | KIM HANSUNG | - |
| dc.contributor.author | Sanghyeon Kim | - |
| dc.contributor.author | Kim Hyung-jun | - |
| dc.date.accessioned | 2024-01-12T13:09:36Z | - |
| dc.date.available | 2024-01-12T13:09:36Z | - |
| dc.date.created | 2021-09-29 | - |
| dc.identifier.uri | https://pubs.kist.re.kr/handle/201004/87650 | - |
| dc.language | English | - |
| dc.publisher | 11.21~24, 제주 | - |
| dc.subject | GaAs | - |
| dc.subject | MOSFET | - |
| dc.subject | CMOS | - |
| dc.subject | wafer bonding | - |
| dc.title | Thin body n- and p-GaAs FET on Si for CMOS integration | - |
| dc.type | Conference | - |
| dc.description.journalClass | 1 | - |
| dc.identifier.bibliographicCitation | The 4th International Conference on Advanced Electromaterials 2017 | - |
| dc.citation.title | The 4th International Conference on Advanced Electromaterials 2017 | - |
| dc.citation.conferencePlace | KO | - |
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