DSpace at KISTKIST Conference PaperOthers

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dc.contributor.authorKim Hyung-jun-
dc.contributor.authorSanghyeon Kim-
dc.date.accessioned2024-01-12T14:05:29Z-
dc.date.available2024-01-12T14:05:29Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/88801-
dc.languageEnglish-
dc.publisher11.6~9, 제주-
dc.subjectwafer bonding-
dc.subjectIII-V-
dc.subjectMOSFET-
dc.subjectM3D-
dc.titleWafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si Substrates-
dc.typeConference-
dc.description.journalClass1-
dc.identifier.bibliographicCitationInternational Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2016)-
dc.citation.titleInternational Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2016)-
dc.citation.conferencePlaceKO-
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