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비아홀 형성 방법, 다층 연성 인쇄회로기판, 및 그 제조 방법

Author

홍재민; 정성묵

Assignee

한국과학기술연구원

Regitration Date

2018-02-20

Registration No.

1832411

Application Date

2016-04-20

Application No.

2016-0048358

Country

KO

URI

https://pubs.kist.re.kr/handle/201004/89187

Appears in Collections:

KIST Patent > 2016

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