p형 반도체의 오믹 접촉을 위한 바인더가 첨가된 MoO2와 ReO2 페이스트 및 공정

Author
최지원김진상강종윤김성근이영신김상태이원재나렌드라 싱백승협
Assignee
한국과학기술연구원
Regitration Date
2020-06-16
Registration No.
10685762
Application Date
2018-05-29
Application No.
15/990824
Country
US
URI
https://pubs.kist.re.kr/handle/201004/91936
Appears in Collections:
KIST Patent > 2018
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