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dc.contributor.authorYU SEUNGGUN-
dc.contributor.authorKim Do-Kyun-
dc.contributor.authorYong Jin Kwon-
dc.contributor.authorCheolmin Park-
dc.contributor.authorHong, Soon Man-
dc.contributor.authorKoo Chong Min-
dc.date.accessioned2024-01-12T18:36:43Z-
dc.date.available2024-01-12T18:36:43Z-
dc.date.created2021-09-29-
dc.identifier.urihttps://pubs.kist.re.kr/handle/201004/94038-
dc.languageEnglish-
dc.titleThermal conductivity of SiC/Nylon6,6 and hBN/Nylon6,6 composites-
dc.typeConference-
dc.description.journalClass2-
dc.identifier.bibliographicCitation한국고분자학회-
dc.citation.title한국고분자학회-
dc.citation.conferencePlaceKO-
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