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Showing results 1 to 7 of 7

Issue DateTitleAuthor(s)
1997-01Effects of post-pattern annealing on electromigration in Al-2Cu interconnects한준현; 신명철
-Electromigration test of a new Cu/WN/MSQ/Si interconnect structureKim, Yong Tae; Kim, Young-Hwan; Kim, Seong Il
2006-09-13Fabrication and performance evaluation of 3-cell SOFC stack based on planar 10 cm x 10 cm anode-supported cellsJung, H. Y.; Choi, S. -H.; Kim, H.; Son, J. -W.; Kim, J.; Lee, H. -W.; Lee, J. -H.
-Investigation into the Recrystallization Phenomena of Cu Damascene LineKim Dong-Ik; Hyo-Jong Lee; Kyu Hwan Oh; Hu-Chul Lee
2017-11Pulsed Electrodeposition of Thin Cobalt Coating Layer on Ferritic Stainless Steel for SOFC InterconnectsKwak, Suk-Chul; Kim, Byung Kyu; Kim, Dong-Ik; Cho, Young Whan
2018-08-22Three-Dimensionally Printed Interconnects for Smart Contact LensesKim, Hyungjoo; Kim, Jinseok; Kang, Jaheon; Song, Yong-Won
-(Undefined)HAN JUN HYUN; SHIN MYUNG CHUL
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