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Electromigration test of a new Cu/WN/MSQ/Si interconnect structure

Authors

Kim, Yong Tae; Kim, Young-Hwan; Kim, Seong Il

Citation

Asia Pacific Interdisciplinary Research Conf.2011, pp.18pp-23

Keywords

Electromigration; copper; interconnect; diffusion barrier; ALD; WN

URI

https://pubs.kist.re.kr/handle/201004/96801

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KIST Conference Paper > Others

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