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Showing results 1 to 5 of 5

Issue DateTitleAuthor(s)
2021-04Copper-graphene heterostructure for back-end-of-line compatible high-performance interconnectsSon, Myungwoo; Jang, Jaewon; Lee, Yongsu; Nam, Jungtae; Hwang, Jun Yeon; Kim, In S.; Lee, Byoung Hun; Ham, Moon-Ho; Chee, Sang-Soo
1999-07Effect of grain structure on the current-density exponent in the black equation for Al-alloy interconnectsHan, JH; Shin, MC; Kang, SH
2001-05-25Electromigration-induced stress interaction between vias and polygranular clustersPark, YJ; Joo, YC
2002-02-01Electromigration-induced via failure assisted by neighboring clustersChoi, IS; Park, YJ; Joo, YC
1998-04-15Enhancement of selective chemical vapor deposition of copper by nitrogen plasma pretreatmentKim, YS; Kim, DJ; Kwak, SK; Kim, EK; Min, SK; Jung, DG
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