Showing results 2 to 2 of 2
Issue Date | Title | Author(s) |
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2018-05-21 | Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion | Kim, Jong Cheol; Kim, Jongsik; Xin, Yan; Lee, Jinhyung; Kim, Young-Gyun; Subhash, Ghatu; Singh, Rajiv K.; Arjunan, Arul C.; Lee, Haigun |