Showing results 9 to 10 of 10
Issue Date | Title | Author(s) |
---|---|---|
- | Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensors | Heung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon |
- | Vacuum in-line packaging technology of AC-PDP using direct-joint method | Duck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang |