Browsing by Author 이남양

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Showing results 1 to 30 of 36

Issue DateTitleAuthor(s)
1996-07A study on the fabrication of vertical-walled cavity and direct bonding method고창기; 주병권; 이윤희, et al
2000-06Application of electrostatic bonding to field emission display vacuum packaging이덕중; 이남양; 정성재, et al
1999-05Characterization of tubeless packaged FED by glass-to-glass anodic bonding methodD. J. Lee; 주병권; 오명환, et al
1998-07Electrostatic bonding between two ITO-coated glass for FED tubeless packaging applications주병권; 이덕중; 정지원, et al
1996-12Experimental analysis of the process of anodic bonding with an evaporated glass layer최우범; 주병권; 이윤희, et al
1997-12Experimental analysis on the anodic bonding with an evaporated glass layer최우범; 주병권; 이윤희, et al
1996-07Experimental analysis on the anodic bonding with evaporated glass layer최우범; 주병권; 이윤희, et al
1998-01FED 기술 및 연구 개발 동향주병권; 이윤희; 오명환, et al
1998-09Glass-to glass wafer anodic bonding and its application to FEA/FED micro-packaging주병권; 이덕중; 정지원, et al
1997-01Glass-to-glass bonding for tubeless packaging of field emission display주병권; 최우범; 이덕중, et al
1998-11Glass-to-glass electrostatic bonding for FED tubeless packaging application주병권; 최우범; 이윤희, et al
1998-08Improvement of bonding properties by pre-bonding at room temperature in Si-glass electrostatic bonding process주병권; 이덕중; 이윤희, et al
1998-05In-situ vacuum packaging method for FEDs in ultra-high-vacuum chamber최우범; 주병권; 이윤희, et al
1999-07Influence of ambient gases on field emission performance in the frit-sealing process of Mo-tip field emission display주병권; 김훈; 정재훈, et al
1999-01Investigation of physical properties of N-doped DLC film and its application to Mo-tip FEA devices주병권; 정재훈; 김훈, et al
2001-04Microdisplay 기술 및 전망주병권; 이남양
1994-01MNS와 MNOS의 특성 및 field emission 소자의 gate insulator로서의 응용주병권; 오명환; 정재훈, et al
2000-01Mo-tip field emitter array having modified gate insulator geometry주병권; 김훈; 이남양
1995-01Needle-type field emitter 를 만들기 위한 실리콘 비등방성 식각에 관한 연구고창기; 주병권; 박흥우, et al
1997-01New packaging method of field emission display using silicon-to-ITO coated glass bonding정지원; 주병권; 최우범, et al
1997-01New Vacuum packaging method of field emission display주병권; 최우범; S. J. Jeong, et al
1997-10Si-Si electrostatic bonding using electron beam-evaporated corning #7740 as an interlayer주병권; 최우범; 이윤희, et al
1997-01Silicon to silicon anodic bonding using lithium doped interlayer정지원; 주병권; 최우범, et al
1998-09Small graphic white-light emitting ZnS:Pr,Ce TFEL displays이윤희; 김영식; 주병권, et al
1999-09Sodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging주병권; 이덕중; 최우범, et al
1989-01SrTiO ₃ capacitor 의 유전성에 대한 2 차 열처리조건의 효과 .윤기현; 안일석; 이남양, et al
1999-07Technical improvement of FED tubeless packaging주병권; 이덕중; 최우범, et al
1999-01The influence of ambient gases during the frit-sealing cycle on the emission characteristics of Mo-FEAs이남양; 김봉철; 정재훈, et al
1998-04Vacuum packaging of field emitter array using electrostatically-bonded glass-Si-glass/glass-glass structure주병권; 이덕중; 정지원, et al
1998-05Vacuum sealing of field-emission arrays using field-assisted bonding method이덕중; 주병권; 이윤희, et al

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