Browsing by Author 최우범

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Showing results 1 to 24 of 24

Issue DateTitleAuthor(s)
1997-03Anodic bonding technique for silicon-to-ITO coated glass bonding최우범; 주병권; 이윤희, et al
1997-01Anodic bonding technique under low temperature and low voltage using evaporated glass최우범; 주병권; 이윤희, et al
1996-07Anodic bonding technique under low-temperature and low-voltage using evaporated glass최우범; 주병권; S. J. Jeong, et al
1996-12Experimental analysis of the process of anodic bonding with an evaporated glass layer최우범; 주병권; 이윤희, et al
1997-12Experimental analysis on the anodic bonding with an evaporated glass layer최우범; 주병권; 이윤희, et al
1996-07Experimental analysis on the anodic bonding with evaporated glass layer최우범; 주병권; 이윤희, et al
2001-07Fabrication of MEMS devices using SOI(silicon-on-insulator)-micromachining technology주병권; 하주환; 서상원, et al
1997-01Glass-to-glass bonding for tubeless packaging of field emission display주병권; 최우범; 이덕중, et al
1998-11Glass-to-glass electrostatic bonding for FED tubeless packaging application주병권; 최우범; 이윤희, et al
1998-05In-situ vacuum packaging method for FEDs in ultra-high-vacuum chamber최우범; 주병권; 이윤희, et al
1997-03Modified low-temperature direct bonding method for vacuum microelectronics application주병권; 이덕중; 최우범, et al
1997-04Modified low-temperature direct bonding method for vacuum microelectronics application주병권; 이덕중; 최우범, et al
1997-01Multi-substrate bonding using anodic bonding method주병권; 이덕중; 최우범, et al
1997-01New packaging method of field emission display using silicon-to-ITO coated glass bonding정지원; 주병권; 최우범, et al
1997-01New Vacuum packaging method of field emission display주병권; 최우범; S. J. Jeong, et al
1999-01Novel bonding technology for hermetically sealed silicon micropackage.이덕중; 주병권; 최우범, et al
1997-10Si-Si electrostatic bonding using electron beam-evaporated corning #7740 as an interlayer주병권; 최우범; 이윤희, et al
1997-01Silicon to silicon anodic bonding using lithium doped interlayer정지원; 주병권; 최우범, et al
1999-09Sodalime-sodalime electrostatic bonding using amorphous silicon interlayer and its application to FEA packaging주병권; 이덕중; 최우범, et al
1999-07Technical improvement of FED tubeless packaging주병권; 이덕중; 최우범, et al
2002-01The analysis of oxygen plasma pretreatment for improving anodic bonding최승우; 최우범; 이윤희, et al
2000-01The effect of 02 plasma treatment on anodic bonding주병권; 최승우; 최우범, et al
2006-03Thermocompression bonding for wafer level hermetic packaging of RF-MEMS devices박길수; 서상원; 최우범, et al
1998-02실리콘과 유리접합을 이용한 FED Packaging정지원; 주병권; 최우범, et al

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