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Browsing byAuthorYun-Kwon Park

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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-RF-MEMS package with vertical via hole for low loss characteristicYun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon
-Thin PDP packaging technology by direct-joint methodDuck-Jung Lee; Ju Byeong Kwon; LEE YUN HI; Yun-Kwon Park; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang; OH MYUNG HWAN
-Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensorsHeung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon
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