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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-A method of improving dielectric constant and adhesion strength of methyl silsesquioxane by using a NH3 plasma treatmentKim Yong Tae
-Improvement in the characteristics of ammonia plasma treated MSQ(Methyl Silsesquioxane)심현상; 김동준; KIM CHUN KEUN; Kim Seong Il; Kim Yong Tae; 전형탁
-Structural and micromechanical characteristics of low-dielectric organosilicate thin films modified by NH₃ plasma treatment차국헌; 주상현; 김수한; 심현상; Kim Yong Tae; 한진희; 이진규; 윤도영

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