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Structural and micromechanical characteristics of low-dielectric organosilicate thin films modified by NH₃ plasma treatment

Authors

차국헌; 주상현; 김수한; 심현상; Kim Yong Tae; 한진희; 이진규; 윤도영

Citation

The Second Asian Conference on Chemical Vapor Deposition, pp.48 - 51

Keywords

low-k; MSQ; interconnection

URI

https://pubs.kist.re.kr/handle/201004/107632

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KIST Conference Paper > Others

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