Showing results 56632 to 56651 of 73577
Issue Date | Title | Author(s) |
---|---|---|
- | W 모양의 굴절률 분포를 갖는 GaAs/AlGaAs strip-loaded 단일모드 곡선 도파로의 복사 손실 . | Byun Young Tae; KPARK KYUNG HYUN; Kim Sun Ho; CHOI SANG SAM; 정영철; 임동건 |
1994-01 | W-Mo-(29~48 wt.%)Cr 합금의 고온산화 . | 최주; 윤국한; 백종현; 이동복; 이종무 |
- | W-waveguide 1×2 MMI coupler by using a PPpinNN heterostructure | Byun Young Tae; 김형권; Park Hwa Sun; KIM JAE HUN; Kim Sun Ho; 이종창 |
- | W-waveguide phase modulator with low propagation loss and high phase modulation efficiency. | Byun Young Tae; Kim Sun Ho |
2021-11 | W@Ag dendrites as efficient and durable electrocatalyst for solar-to-CO conversion using scalable photovoltaic-electrochemical system | Lee, Woong Hee; Lim, Chulwan; Ban, Eunseo; Bae, Soohyun; Ko, Jongwon; Lee, Hae-Seok; Min, Byoung Koun; Lee, Kwan-Young; Yu, Jae Su; Oh, Hyung-Suk |
- | Wafer bonding between InP and Ce:YIG(CeY2Fe5O12) using O2 plasma surface activation for an integrated optical waveguide isolator | Roh Jong Wook; YANG, JEONG SU; 옥성해; Woo, Deok Ha; Byun, Young Tae; Jhon, Young Min; T. Mizumoto; W. Y. Lee; Lee, Seok |
- | Wafer Bonging Process for III-V MOSFET and Monolithic 3D Integration on Si Substrates | Kim Hyung-jun; Sanghyeon Kim |
- | Wafer direct bonding between InP and GGG(Gd3Ga5O12) using O2 plasma | Roh Jong Wook; YANG, JEONG SU; 옥성해; Lee, Seok; Woo, Deok Ha; Byun, Young Tae; Jhon, Young Min; 이우영 |
- | Wafer level sealing technology of MEMS devices using B-stage epoxy | 박흥우; 박윤권; 이덕중; 김철주; PARK JEONG HO; 서용교; 김정우; SONG CI MOO; OH MYUNG HWAN; Ju Byeong Kwon |
1993-01 | Wafer surface scanner 를 이용한 반도체 웨이퍼상의 입자 침착속도의 측정 | 배귀남; 박승오; 이춘식; 명현국; 신흥태 |
2006-01-15 | Wafer-level transfer of thermo-piezoelectric Si3N4 cantilever array on a CMOS circuit for high density probe based data storage | CHO, IL JOO |
2018-01 | WAFER-SCALE FABRICATION OF BIODEGRADABLE SILK-FIBROIN-BASED MEMRISTORS | Kook, Geon; jeong, so hyeon; Kim, Mikyung; Lee, Hyunjoo J.; Kim, Hyojung; Choi, Nakwon; Lee, Sungwoo |
2020-09 | Wafer-scale Fabrication of Nanometer Silicon Posts for Capacitive Micromachined Ultrasonic Transducers with Substrate-Embedded Springs | Kim, Hae Youn; Kang, Dong-Hyun; Lee, Byung Chul; Khuri-Yakub, Butrus T.; Kim, Jinsik |
2011-03 | Wafer-Scale Growth of ITO Nanorods by Radio Frequency Magnetron Sputtering Deposition | Park, Jae Hyoung; Park, Hoo Keun; Jeong, Jinhoo; Kim, Woong; Min, Byoung Koun; Do, Young Rag |
2016-05 | Wafer-scale growth of MoS2 thin films by atomic layer deposition | Pyeon, Jung Joon; Kim, Soo Hyun; Jeong, Doo Seok; Baek, Seung-Hyub; Kang, Chong-Yun; Kim, Jin-Sang; Kim, Seong Keun |
2016-08-10 | Wafer-scale high-resolution patterning of reduced graphene oxide films for detection of low concentration biomarkers in plasma | Kim, Jinsik; Chae, Myung-Sic; Lee, Sung Min; Jeong, Dahye; Lee, Byung Chul; Lee, Jeong Hoon; Kim, YoungSoo; Chang, Suk Tai; Hwang, Kyo Seon |
2019-01-09 | Wafer-Scale Multilayer Fabrication for Silk Fibroin-Based Microelectronics | Kook, Geon; Jeong, Sohyeon; Kim, So Hyun; Kim, Mi Kyung; Lee, Sungwoo; Cho, Il-Joo; Choi, Nakwon; Lee, Hyunjoo J. |
2013-06 | Wafer-Scale Production of Uniform InAsyP1-y Nanowire Array on Silicon for Heterogeneous Integration | Shin, Jae Cheol; Lee, Ari; Mohseni, Parsian Katal; Kim, Do Yang; Yu, Lan; Kim, Jae Hun; Kim, Hyo Jin; Choi, Won Jun; Wasserman, Daniel; Choi, Kyoung Jin; Li, Xiuling |
2018-11 | Wafer-scale single-crystal hexagonal boron nitride film via self-collimated grain formation | Lee, Joo Song; Choi, Soo Ho; Yun, Seok Joon; Kim, Yong In; Boandoh, Stephen; Park, Ji-Hoon; Shin, Bong Gyu; Ko, Hayoung; Lee, Seung Hee; Kim, Young-Min; Lee, Young Hee; Kim, Ki Kang; Kim, Soo Min |
2023-06 | Wafer-scale transistor arrays fabricated using slot-die printing of molybdenum disulfide and sodium-embedded alumina | Kwon, Yonghyun Albert; Kim, Jihyun; Jo, Sae Byeok; Roe, Dong Gue; Rhee, Dongjoon; Song, Younguk; Kang, Byoungwoo; Kim, Dohun; Kim, Jeongmin; Kim, Dae Woo; Kang, Moon Sung; Kang, Joohoon; Cho, Jeong Ho |