Application of electrostatic bonding to FED packaging

Authors
Duck-Jung LeeJu Byeong KwonNam-Yang LeeSeong-Jae JeongJin-JangOH MYUNG HWAN
Citation
IVMC '99, pp.44 - 45
Keywords
FED; FEA; MEMS
URI
https://pubs.kist.re.kr/handle/201004/109122
Appears in Collections:
KIST Conference Paper > Others
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