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Other Titles
이온보조 반응법을 이용한 금속과 고분자의 접착력 향상에 관한 연구
Authors
KOH SEOK KEUN최성창한성CHOI WON-KOOK정형진SON YONG BAE
Citation
Proceedings of 4th International Symposim on Microelectronics and Packaging, April 20, 1998, Seoul,, pp.41 - 52
Keywords
키워드
URI
https://pubs.kist.re.kr/handle/201004/110207
Appears in Collections:
KIST Conference Paper > Others
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