이온보조 반응법을 이용한 금속과 고분자의 접착력 향상에 관한 연구

Authors
KOH SEOK KEUN최성창한성CHOI WON-KOOK정형진SON YONG BAE
Issue Date
1998-04
Citation
Proceedings of 4th International Symposim on Microelectronics and Packaging, April 20, 1998, Seoul,, pp.41 - 52
Keywords
키워드
URI
https://pubs.kist.re.kr/handle/201004/110207
Appears in Collections:
KIST Conference Paper > Others
Export
RIS (EndNote)
XLS (Excel)
XML

qrcode

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.

BROWSE