Enhanced via reliability by Al-reflow for multi-level metallization

Authors
Park In Seon위영진이현덕박창수최길현Jung Woo Sang이문용이문용
Citation
International conference on VLSI and CAD (ICVC, 95), v.95, no.195, pp.29 - 32
Keywords
Al-reflow
URI
https://pubs.kist.re.kr/handle/201004/111831
Appears in Collections:
KIST Conference Paper > Others
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