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Showing results 14 to 15 of 15

Issue DateTitleAuthor(s)
-The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization.Kim Yong Tae; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi
1995-01The properties of nitrogen implanted tungsten diffusion barrier for Cu metallization.김용태; C. S. Kwon; D. J. Kim; J. Y. Lee; I. H. Choi
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