| - | Fabrication and characterization of diode-type Si field emitter array | 박흥우; Ju Byeong Kwon; Kim Sung Jin; Jung Jae Hoon; PARK JEONG HO; OH MYUNG HWAN |
| - | Fabrication and characterization of DLC-coated field emitter arrays | KO CHANG GI; Ju Byeong Kwon; LEE YUN HI; Jung Ho Park; OH MYUNG HWAN |
| - | Fabrication and characterization of gated FEAs using carbon nanotubes | 장윤택; CHOI CHANG HOON; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; 민남기; AHN JIN HO |
| - | Fabrication and characterization of piezoresistive-type Si pressure microsensor | Ju Byeong Kwon; OH MYUNG HWAN |
| - | Fabrication and characterization of silicon field emission device | 고창기; Jung Jae Hoon; Ju Byeong Kwon; 장진; 김철주; OH, MYUNG HWAN |
| - | Fabrication and characterization of strip-shaped diamond field emitter array | Ju Byeong Kwon; OH MYUNG HWAN; S. J. Kim; B. S. Park; Y. J. Baik; S. Lim |
| - | Fabrication and field emission study of 2-inch DLC coated Si FEAs panel | 이상조; KANG HO KWAN; Ju Byeong Kwon; Moon Sung Wook; LEE YUN HI; 전동렬; OH MYUNG HWAN |
| - | Fabrication and field emission study of gated diamondlike-carbon-coated silicon tips. | 이상조; Ju Byeong Kwon; LEE YUN HI; OH MYUNG HWAN; 전동렬; C. G. Ko |
| - | Fabrication and field-emission study of 2-inch DLC-coated Si FEA panel | Ju Byeong Kwon; 이상조; Jung Jae Hoon; LEE YUN HI; 전동렬; OH MYUNG HWAN |
| - | Fabrication and silmulation results of spiral inductors using the micromachining technology | 김현호; Ju Byeong Kwon; Lee Jeon Kook; OH MYUNG HWAN; KIM SOO WON |
| - | Fabrication of (100), (110), (111) Si tip using various wet etching method | 박흥우; Ju Byeong Kwon; KO CHANG GI; 홍순관; OH MYUNG HWAN; 김철주 |
| - | Fabrication of DLC-coated field emitter triode using aluminum parting layer | 이상조; 이선엽; D. Jeon; K. R. Lee; Ju Byeong Kwon; OH MYUNG HWAN |
| - | Fabrication of flexible FBAR using thin silicon wafer. | 김용국; 배용환; 강유리; Kim Jai Kyeong; KIM SOO WON; Ju Byeong Kwon |
| - | Fabrication of high-yield Si micro-diaphragms using electrochemical etch-stop in TMAH/IPA/pyrazine solution | Gwiy-Sang Chung; Chin-Sung Park; Ju Byeong Kwon |
| - | Fabrication of integrated triode-type CNT field emitters. | 채수경; 이정아; 장윤택; 이양두; Cho Woo; 문승일; LEE YUN HI; 이상근; Ju Byeong Kwon |
| - | Fabrication of knife type Si tip array by orientatio dependent etching of single silicon substrate | 정유호; 고창기; 김철주; Ju Byeong Kwon; OH MYUNG HWAN |
| - | Fabrication of MEMS devices using SOI(silicon-on-insulator)-micromachining technology | Ju Byeong Kwon; 하주환; 서상원; 최승우; 최우범 |
| - | Fabrication of metallic nanowires for nano-electronics | 장윤택; CHOI CHANG HOON; Ju Byeong Kwon; LEE YUN HI; 이창우; 김동호; 민남기 |
| - | Fabrication of micromechanical structures for integrated IR sensor application | Ju Byeong Kwon; 박재석; CHUNG MOONKYO; Sang-Seop Yom; SUH SANG HEE; 장진; OH MYUNG HWAN |
| - | Fabrication of piezoresistive pressure sensor and its application to digital pressure guage | 하병주; Ju Byeong Kwon; 박선우; 차균현; OH MYUNG HWAN; 김철주 |
| - | Fabrication of piezoresistive pressure sensor based on poly-Si | 임재홍; YOON SEOK JIN; Ju Byeong Kwon; Yoon Young Soo |
| - | Fabrication of self-aligned silicon field emitters coated with diamond-like carbon | Ju Byeong Kwon; OH MYUNG HWAN; S. J. Lee; S. N. Lee; S. W. Lee; D. Jeon; K. R. Lee |
| - | Fabrication of Si tips for field emission devices | Ju Byeong Kwon; OH MYUNG HWAN; 박흥우; 하병주; 박재홍; 김철주 |
| - | Fabrication of Si, Mo tip FEAs and FED application | Ju Byeong Kwon; 이상조; Kim Hun; 이덕중; OH MYUNG HWAN |
| - | Fabrication of the microfluidic LOC system for fluorescence detector. | KIM HYUN KEE; SHIN KYEONG SIK; 김용국; LEE SANG YOUL; Ju Byeong Kwon |
| - | Fabrication of the triode structure FEA using the directly grown CNTs on Si02-Si substrate and field emission properties | 장윤택; 서도석; Ju Byeong Kwon; OH MYUNG HWAN; AHN JIN HO; 고창기; Jung Jae Hoon; 박공석; LEE YUN HI |
| - | Fabrication of tungsten nanowires using self-catalytic function | CHOI CHANG HOON; 장윤택; Ju Byeong Kwon; LEE YUN HI; 민남기; AHN JIN HO |
| - | Fabrication of un-cooled infrared sensor using pyroelectric thin film | 박윤권; Ju Byeong Kwon; 박흥우; Yoon Young Soo; Sang-Seop Yom; Oh Young-Jei; PARK JEONG HO; SUH SANG HEE; OH MYUNG HWAN; 김철주 |
| - | FED Tubeless packaging by vacuum-electrostatic bonding | Ju Byeong Kwon; 이덕중; 정지원; 안준호; Kim Hun; OH MYUNG HWAN |
| 1996-09 | FED 기술 강좌 : FED 기술의 개발 현황 및 제품화 전망 | Ju Byeong Kwon; OH MYUNG HWAN |
