Browsing byAuthorDuck-Jung Lee

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Showing results 1 to 10 of 10

Issue DateTitleAuthor(s)
-Application of electrostatic bonding to FED packagingDuck-Jung Lee; Ju Byeong Kwon; Nam-Yang Lee; Seong-Jae Jeong; Jin-Jang; OH MYUNG HWAN
-Development of AC-PDP tubeless packaging method and their operating characteristicsSeung-Woo Choi; Ju Byeong Kwon; Duck-Jung Lee; LEE YUN HI; OH MYUNG HWAN; Gwon-Jin Moon; Jun-Dong Kim; Jin-Wook Jeoung; Young-Cho Kim
-Development of flat type back-lamp using carbon nano tubes grown on glass substrateLEE YANG DOO; Duck-Jung Lee; Jeung Hoon Park; Jae-eun Yoo; Yun-Hi Lee; Jin Jang; Ju, Byeong Kwon
-Flat lamp packaging technology using carbon nano tubesDuck-Jung Lee; LEE YUN HI; Ju Byeong Kwon; Jae-Eun Yoo; Byung-Don Min; Jeung-Hoon Park; Bong-Chul Kim; Byung-Kyo Lee; Jin Jang
-PDP tubeless packaging by using epoxy gluing process at room temperatureSeung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
-PDP tubeless packaging using B-stage epoxySeung-Il Moon; Duck-Jung Lee; OH MYUNG HWAN; LEE YUN HI; Ju Byeong Kwon; Young-Cho Kim; Gwon-Jin Moon; Jun-Dong Kim
-RF-MEMS package with vertical via hole for low loss characteristicYun-Kwon Park; Heung-Woo Park; Duck-Jung Lee; Jung-Ho Park; Chung-Woo Kim; Ci-Moo Song; Chul-Ju Kim; Ju Byeong Kwon
-Thin PDP packaging technology by direct-joint methodDuck-Jung Lee; Ju Byeong Kwon; LEE YUN HI; Yun-Kwon Park; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang; OH MYUNG HWAN
-Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensorsHeung-Woo Park; Yun-Kwon Park; Duck-Jung Lee; Chul-Ju Kim; Jung-Ho Park; OH MYUNG HWAN; Ju Byeong Kwon
-Vacuum in-line packaging technology of AC-PDP using direct-joint methodDuck-Jung Lee; Seung-Il Moon; LEE YUN HI; Ju Byeong Kwon; Jun-Dong Kim; Gwon-Jin Moon; Jin Jang

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