Browsing by Author Duck-Jung Lee

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Showing results 1 to 13 of 13

Issue DateTitleAuthor(s)
1999-07Application of electrostatic bonding to FED packagingDuck-Jung Lee; 주병권; Nam-Yang Lee, et al
2001-06Development of AC-PDP tubeless packaging method and their operating characteristicsSeung-Woo Choi; 주병권; Duck-Jung Lee, et al
1999-09Effects of a hydrophilic surface in anodic bondingDuck-Jung Lee; 주병권; Jin Jang, et al
2001-10Flat lamp fabrication using thermal grown carbon nano tubesDuck-Jung Lee; 주병권; 이윤희, et al
2001-08Flat lamp packaging technology using carbon nano tubesDuck-Jung Lee; 이윤희; 주병권, et al
2001-03Glass-to-glass electrostatic bonding with intermediate amorphous silicon film for vacuum packaging of microelectronics and its applicationDuck-Jung Lee; 이윤희; Jin Jang, et al
2001-07New plasma display panel packaging technology using electrostatic bonding methodDuck-Jung Lee; Jin-Wook Jeong; Young-Cho Kim, et al
2001-08PDP tubeless packaging by using epoxy gluing process at room temperatureSeung-Il Moon; Duck-Jung Lee; 오명환, et al
2001-10PDP tubeless packaging using B-stage epoxySeung-Il Moon; Duck-Jung Lee; 오명환, et al
2001-10RF-MEMS package with vertical via hole for low loss characteristicYun-Kwon Park; Heung-Woo Park; Duck-Jung Lee, et al
2001-10Thin PDP packaging technology by direct-joint methodDuck-Jung Lee; 주병권; 이윤희, et al
2001-10Vacuum in-line packaging and characterization of the surface-micromachined vacuum magnetic field sensorsHeung-Woo Park; Yun-Kwon Park; Duck-Jung Lee, et al
2001-08Vacuum in-line packaging technology of AC-PDP using direct-joint methodDuck-Jung Lee; Seung-Il Moon; 이윤희, et al