Showing results 3 to 4 of 4
Issue Date | Title | Author(s) |
---|---|---|
- | Improvement in diffusion barrier properties of PECVD W-N thin film by low energy BF2+ implantation | 김동준; Kim Yong Tae; PARK YOUNG KYUN; 심현상; 박종완 |
2001-03 | Improvement of the reliability of a Cu/W-N/SiOF multilevel interconnect by inserting plasma enhanced chemical vapor deposited W-N thin film | Kim, DJ; Sim, HS; Lee, S; Kim, YT; Kim, SI; Park, JW |