Showing results 19 to 23 of 23
Issue Date | Title | Author(s) |
---|---|---|
1997-11-15 | Nanostructured Ta-Si-N diffusion barriers for Cu metallization | Kim, DJ; Kim, YT; Park, JW |
1999-07 | New method to prepare W-B+-N ternary barrier to Cu diffusion by implanting BF2+ ions into W-N thin film | Kim, DJ; Kim, YT; Park, JW |
1998-01 | RF power dependence of stresses in plasma deposited low resistive tungsten films for VLSI devices | 이창우; 고민경; 오환원; 우상록; 윤성로; 김용태; 박영균; 고석중 |
- | Stress evolution and diffusion barrier performance of La0.67Sr0.33MnO3 (LSMO)/WCN/Si structure | Chang Woo Lee; Kim, Yong Tae; Akihiro Wakahara; KIM Hee Joon |
2000-09 | Thermal stability of tungsten-boron-nitride thin film as diffusion barrier | Park, YK; Kim, SI; Kim, YT; Lee, CW |