Showing results 75 to 78 of 78
Issue Date | Title | Author(s) |
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2011-02-10 | Ternary Pt-Fe-Co Alloy Electrocatalysts Prepared by Electrodeposition: Elucidating the Roles of Fe and Co in the Oxygen Reduction Reaction | Hwang, Seung Jun; Yoo, Sung Jong; Jang, Soohwan; Lim, Tae-Hoon; Hong, Seong Ahn; Kim, Soo-Kil |
2008-04-30 | The influence of thiourea on copper electrodeposition: Adsorbate identification and effect on electrochemical nucleation | Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong |
2009-01 | Thin film silver deposition by electroplating for ULSI interconnect applications | Seo, Joon-Mo; Cho, Sung Ki; Koo, Hyo-Chol; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong |
2008-01 | Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid | Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong |