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Showing results 1 to 3 of 3

Issue DateTitleAuthor(s)
-Effects of current wave forms and current densities on the electroplated Cu interconnection in damascene plating이유용; PARK YOUNG JOON; Cho Byung Won; 이재봉
-Electrical Characteristics of Atomic Layer Deposited Tungsten Nitride Diffusion Barrier for Cu InterconnectsKim, Yong Tae; Lee Eui-Bok; Kim, Young-Hwan; KIM, CHUN KEUN; Byeong Kwon
2001-10구리배선의 electromigration 신뢰성PARK YOUNG JOON
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