Showing results 1 to 3 of 3
Issue Date | Title | Author(s) |
---|---|---|
- | Effects of current wave forms and current densities on the electroplated Cu interconnection in damascene plating | 이유용; PARK YOUNG JOON; Cho Byung Won; 이재봉 |
- | Electrical Characteristics of Atomic Layer Deposited Tungsten Nitride Diffusion Barrier for Cu Interconnects | Kim, Yong Tae; Lee Eui-Bok; Kim, Young-Hwan; KIM, CHUN KEUN; Byeong Kwon |
2001-10 | 구리배선의 electromigration 신뢰성 | PARK YOUNG JOON |