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Issue DateTitleAuthor(s)
2019-09-29Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conductionLee, Seung Hwan; Yu, Seunggun; Shahzad, Faisal; Hong, Junpyo; Noh, Seok Jin; Kim, Woo Nyon; Hong, Soon Man; Koo, Chong Min
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