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Showing results 1 to 2 of 2

Issue DateTitleAuthor(s)
2001-10Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder jointsShin, CX; Baik, YJ; Huh, JY
2011-05-24Microstructure and mechanical properties of annealed SUS 304H austenitic stainless steel with copperSen, Indrani; Amankwah, E.; Kumar, N. S.; Fleury, E.; Oh-ishi, K.; Hono, K.; Ramamurty, U.
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