Showing results 1 to 5 of 5
Issue Date | Title | Author(s) |
---|---|---|
2012-12-15 | Creep behavior and microstructure evolution at 750 degrees C in a new precipitation-strengthened heat-resistant austenitic stainless steel | Vu The Ha; Jung, Woo Sang |
1995-01 | High temperature thermal stability of plasma-deposited tungsten nitride Schottky contacts to GaAs | Lee, C.W.; Kim, Y.T. |
2013-12 | Interface-directed spinodal decomposition in TiAlN/CrN multilayer hard coatings studied by atom probe tomography | Povstugar, Ivan; Choi, Pyuck-Pa; Tytko, Darius; Ahn, Jae-Pyeong; Raabe, Dierk |
2021-11-15 | Memory effect of vertically stacked hBN/QDs/hBN structures based on quantum-dot monolayers sandwiched between hexagonal boron nitride layer | Shim, J.; Lee, J.S.; Lee, J.H.; Yun, Y.J.; Park, S.K.; Angadi, B.; Son, D.I. |
1999-05 | N2+ implantation approaches for improving thermal stability of Cu/Mo/Si contact structure | Kim, Y.T.; Kim, D.J.; Park, J.-W. |